Observation report 20070720

Presented by YS Lin 2007-7-20 Observation Report

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Visual evaluation of a good factory ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Visual evaluation of a good factory 5. Performance-information on the line per line per workplace Information on . Quality (short loop) . Efficiency (output) 6. Number of indirects on the floor? How many people “hanging-around” for . Supervision? (why?) . Q-problems . Material supply 7. Contact pattern? . Management presence on the floor? . Open offices?

Visual evaluation of a good factory 8. Is “production” the heart of the business? Are support departments really supporting? 9. Housekeeping Is the place clinically clean? 10. Working atmosphere? Do we smell the “winning spirit” ? 11. Would you like your son or daughter to work here in the “production” ?

Quality Target/Plan Control 1.Current state 2.Observation .Improvement plan by PDCA cycle with 5W2H approach .Variance analysis by CAR .Control chart/Flag chart system for management

Control Plan 1. Current state 2. Observation . Used for new product . Sampling plan design/correlation- Outside in IQC  EPI gate  FE gate  FQC  Customer IQC . Identical specification or engineering spec . Process verification between Product and Process characteristics . Responsibility between production and QA Production: operation, parameters check, self-inspection QA: Sampling, gate control, process audit .Visual inspection/control: QA  Production, Source management . Control method: application of MSA, SPC, Fool-proof, etc . Control document enhancement . Abnormal: Effectiveness of failure report

3. Process check sheet design Ex: Prober by QA 4. ISO document review .Junior consultant? .Speak- Write – Doing  consistency? 5. Failure report review 異常報告單 .Design concept- open loop, sufficient analysis ability? .Top- 3 QMT teams organized- 側蝕 , 針痕 , 顏色異常 6. Reliability test- 恆溫恆濕 temperature, humidity? 7. Human resource: effective training, technical convention

Production Control M M+1 23 25 Sales forecast - Stock available =Net requirement Stagger table Production plan Production scheduling EPI FE BE PO Order Book Combined SO Shipping Instruction Bin table FQC Transaction Work order Closed SFM 驗證 Run Run card

1.Coding: Raw material, parts, WIP, Finished product, Grade, Stock, Run card, Wafer no, Tape no, dept code, machine no, document, A/C, etc 2.Heavy loading to review the stock by bin and SO by range 3.MOQ, Lot size, extra costs for special grade? 4.Production to max capacity- high inventory 5.Capacity review model, bottle-neck management 6.No run card for EPI and BE  FIFO, real time tracking? 7.Mixed EPI lot input for FE – Between lot variation 8.Material requisition  Issue 9. 驗證 run- Process verification run

10.Transaction stage: total 25 in FE  Main control stage 11.Manual tracking and expediting 12.Backlog issues: EPI, Quality, PM, single skill, 13.With 24 Hours full running: less flexibility to catch-up 14.Review mechanism: Sample run? Pilot run? New product? 15.Push  Pull, flow line, JIT, TPM? 16.Delivery performance indicators Throughput Yield Inventory Shipping quantity Loading OTD: on time delivery CLIP: cumulative line item performance CVP: cumulative volume performance Cycle time Inventory turns + σ ↓ Mean ↓

品質的發展品質的歷史面品質的觀念面品質的制度面作業員的品質管制領班的品質管制檢驗員的品質管制統計的品質管制品質保證全面品質管制全面品質保證品質是“檢查”出來的品質是“製造”出來的品質是“設計”出來的品質是“管理”出來的品質是“習慣”出來的全面品管 (TQC) 品檢 (QI) 品管 (QC) 品保 (QA) 全面品保 (TQA)

CONTINUOUS IMPROVEMENT-CONCEPT 日常管理實力維持方針管理實力提昇 . 減少變異 . 提昇水準願景 A C P D A C P D A C S D A C S D

The New Shop Floor Management Model □ Glass wall management □ Scoreboard □ Floor meeting □ Organization of a work station □ Suggestion □ Storyboard □ Mini-company (Mission,Objectives,Business plan,PDCA) □ Improvement group □ Banker's meeting (Progress report,Monthly report ,Annual report) □ Study group □ Company awareness day □ Top management round table □ Sharing of progress (Display,Free lunch,Presentation ,Newsletter,Awards) □ Policy management □ Cross-functional management □ Management by exception □ Management by objectives □ Managing by wandering around □ Career planning □ 5S □ SOP □ JIT □ TPM □ Flow lines □ Poka-yoke Continuous Improvement □ Core values □ Vision □ Roles & responsibilities □ Management process □ Genba □ Exposing problems □ 5 Whys □ Empowerment □ Ownership □ Involvement of everybody □ Teamwork □ Collective wisdom □ Self-management □ Problem-solving tools □ Assessment □ Checklist □ Visual aids □ Benchmarking □ Upgrading skills □ Learning □ Recognition,Reward □ Communication □ Cross-training □ Job rotation Customer Need Customer-supplier relationship Thorough practice Adequate leadership Innovative culture Customer orientation Progressive organization People-oriented organization Increased capabilities Waste elimination Survival of the fittest Shop floor excellence CONCEPT/APPROACH ACTIVITIES GOALS

Management of Mini-Company ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Organize the meeting area Organize an efficient work station Practice

QC 問題解決的步驟及 QC 手法找出問題點現狀的把握及目標的設定表示原因及結果的關係要因的解析柏拉圖散佈圖直方圖查檢圖管制圖特性要因圖 A B C 1 2 3 4 5

QC 問題解決的步驟及 QC 手法要因的解析層別有相關有時間的變化對策的檢討及實施效果的確認標準化 ( 制 / 修定 ) 效果的維持 * * * * * * * * * * * A B C D E A B C D E

QC. STORY SHEET ASEK Dept .:_______ Leader :_______ Action Group :_______________________ 2. Why The Theme Selected 3. Analysis of Present Situation( Data Collection) 4. Cause & Effect Analysis Remark ： 8.Remaining Problems / Future Plan 1 ._________________________________ 2 ._________________________________ 3 .___________ ______________________ 4 ._________________________________ 5 ._________________________________ 6 ._________________________________ 7.Standardization 1 .________________________________ 2 .________________________________ 3 ._________________ _______________ 4 .________________________________ 5 .________________________________ 6 .________________________________ 7 .________________________________ 8 .________________________________ A P 6. Results Confirmation C Remark ： D 5. Action Plan / Implementation Remark ： 1. Theme Schedule Plan Actual Item Corrective Action Action by Fi ni sh Evidence

C A D P Team name ( 圈名 ) ： Dep’t ( 部門 ) ： 1.Theme ( 主題 ) ： 2.Why select this theme ( 選定理由 ) ： 3. Current status ( 現況分析 ) ： 4.Target Setting ( 目標設定 ) ： 5. Cause-Effect Analysis ( 要因分析 ) ： 6. Root Cause Verification ( 真因尋求 ) ： 7.Action implementation ( 對策實施 ) ： 8. Result Confirmation ( 效果確認 ) 　 9.Standardization ( 標準化 ) ： 10.Future chance ( 改善機會 ) ： ‧ 創意來源 ( 參考文獻 ) / Learning ‧ Solution ( 對策方法 ) ： ‧ Sharing ( 經驗分享 ) ： ‧ Learning ( 學習 ) ： ‧ Reference ( 參考文獻 ): One Page QC Story

Pad damage C A D P One Page QC Story - QIT 53 rd Team name: Dep’t: 1.Theme: 2.Why select this theme 3. Current status 4.Target Setting: 5. Cause-Effect Analysis 6. Root Cause Verification 7. Action implementation 8.Result Confirmation 9.Standardization 10.Future chance ‧ Learning ‧ Solution ‧ Sharing Dragon WTF Reduce fine pad damage rate 1.More competitive 2,High Quality and On Time Delivery 3.Capability Improvement 4.Utilization improvement 5. Short Through Put Time Pad damage from 230ppm to 50ppm Pad damage 1.Cleaning travel is too long 2.Tip is too large for small pads 3.PCB expansion causes probe mark shift. Upper limit for tip 25um Large Tip Root Cause ： Cleaning travel is too long 1. Needle Mis-alignment Improvement 2. Large probe mark improvement Tip Reduction Machine:PSK 2000 Root Cause ： Tip is too large for small pads Action-New needle spec. for small pad Tip size change slope: 0.1um/um Action: start Test from wafer center Root Cause ： PCB expansion causes probe mark shift. 3. Probe Mark Shift improvement Learning: 1. Technology learning – HSM Use N2 gas to prevent AL from forming oxide 2. Benchmarking- MOTOROLA / STMicroelectronics Test temperature / Pad size / Needle clean method 3. Create idea : Pencil Sharpener Reference: 1. QIT-51, Team : Crystal, Subject : First time pass yield 2. Engineering Report No: EBV-3-10-62/88x EBV-9-1-1/10x 3. Process development(TAC Sub-100nm Probing): . Set of < MAT20> TESTCHIPS . Platform Qualification <MAT30> 1.Probe card needles specification change 2.Probe Card Quality Control 3.Product file for wafer test change EBV-3-10-62/883 EBV-9-1-1/101 EBV-3-10-62/883 Total saving: 1,410,000 USD § Sharing the experience an best practices with PSC, PST § Nijmegen and Caen for probing fine pad product. Action:Reduce needles cleaning path ,[object Object],[object Object],[object Object],Saving Probe mark misalignment improvement Side wall crack improvement Probe mark shift improvement Mis-alignment ,[object Object],[object Object],Side wall crack ,[object Object],Probe mark shift ,[object Object],[object Object],Large stress   small stress Large force 50um

異常報告之運用異常處理 1. 管理 , 控制基準 2. 異常發現 3. 異常處置 4. 執行追蹤異常報告彙總整理經常發生根本問題解決檢討報告書檢討‧ 分析效果確認標準化日常管理報告書要項 1. 問題點 2. 影響評估 3. CAUSE 4. 改進對策層別 5. 相關單位 / 擔當者 6. 完成日期 (EST,ACT) 應急措施再發防止點線面 ( 影響度 x 發生度 x 檢出度 = 重要度 ) 生產影響 , 重要度 ● 維持活動 ● HORIZONTAL DEPLOYMENT 推廣‧‧運用擔當者 : 幹部 SUP. SR SUP. Y

Observation report 20070720

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